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Tony F HeinzDepts. of Applied Physics, Photon Science, and, by courtesy, of Electrical Eng., SLAC, StanfordVerified email at stanford.edu
James C. HoneDepartment of Mechanical Engineering, Columbia UniversityVerified email at columbia.edu
Alexey ChernikovDresden University of Technology (TU Dresden), University of RegensburgVerified email at tu-dresden.de
Heather M. HillBureau of Engraving and Printing, Department of TreasuryVerified email at bep.gov
Albert RigosiNational Institute of Standards and TechnologyVerified email at nist.gov
Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityVerified email at snu.ac.kr
Daniel A. ChenetColumbia UniversityVerified email at columbia.edu
Annie Xian ZhangMechanical Engineering, Stevens Institute of TechnologyVerified email at stevens.edu
Philip KimHarvard UniversityVerified email at g.harvard.edu
Yufeng HaoProfessor of Materials Science and Engineering, Nanjing UniversityVerified email at nju.edu.cn
Mark S HybertsenSenior Physicist, Emeritus, Center for Functional Nanomaterials, Brookhaven National LaboratoryVerified email at bnl.gov
Lei WangColumbia UniversityVerified email at columbia.edu
Damon B. FarmerIBM T.J. Watson Research CenterVerified email at us.ibm.com
Phaedon AvourisIBM Fellow, Emeritus and University of Minnesota, MinneapolisVerified email at umn.edu
En-Min ShihColumbia UniversityVerified email at columbia.edu
David ReisStanford PULSE Institute, Department of Applied Physics, Department of Photon ScienceVerified email at stanford.edu
Hanzhe LiuPurdue UniversityVerified email at purdue.edu
Yong Sing YouStanford UniversityVerified email at slac.stanford.edu
Shambhu GhimireSLAC National Accelerator Lab & Stanford UniversityVerified email at slac.stanford.edu
Cory R. DeanColumbia UnviersityVerified email at phys.columbia.edu