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Citations per year
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Cited by
All
Since 2020
Citations
474
380
h-index
3
3
i10-index
3
3
0
100
50
25
75
2017
2018
2019
2020
2021
2022
2023
2024
2025
6
34
51
58
92
65
80
79
6
Co-authors
Jiyoung Kim
Professor, Department of Materials Science and Engineering, University of Texas at Dallas
Verified email at utdallas.edu
Harrison Sejoon Kim
Intel ATTD
Verified email at intel.com
Lanxia Cheng
Staff Engineer_EMD Electronics
Verified email at emdgroup.com
Xin Meng
PhD, Electrical Engineering, The University of Texas at Dallas
Verified email at utdallas.edu
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Joy S. Lee
Materials Science and Engineering Ph.D. Candidate,
University of Texas at Dallas
Verified email at utdallas.edu
Atomic layer deposition (ALD)
Thermal management
Plasma Enhanced Chemical Vapor Deposition (PECVD)
Semiconductor devices
Articles
Cited by
Co-authors
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Cited by
Year
Large ferroelectric polarization of TiN/Hf0. 5Zr0. 5O2/TiN capacitors due to stress-induced crystallization at low thermal budget
SJ Kim, D Narayan, JG Lee, J Mohan, JS Lee, J Lee, HS Kim, YC Byun, ...
Applied Physics Letters 111 (24)
, 2017
318
2017
Atomic layer deposition of silicon nitride thin films: a review of recent progress, challenges, and outlooks
X Meng, YC Byun, HS Kim, JS Lee, AT Lucero, L Cheng, J Kim
Materials 9 (12), 1007
, 2016
140
2016
Low temperature (400° C) ferroelectric Hf0. 5Zr0. 5O2 capacitors for next-generation FRAM applications
SJ Kim, D Narayan, JG Lee, J Mohan, JS Lee, J Lee, CD Young, J Kim, ...
2017 IEEE International Memory Workshop (IMW), 1-4
, 2017
16
2017
Inversion behavior of ALD HfZrO2/InGaAs MOS capacitors with in-situ DEZ-H2O treatment
JG Lee, YC Byun, D Narayan, AT Lucero, J Kim
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