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Co-authors
- Denis L. Nika (Nica)Moldova State UniversityVerified email at usm.md
- Desalegne TeweldebrhanTechnology Development, Nano-Research, Ph.DVerified email at ucr.edu
- Fariborz KargarAssistant Professor, Auburn UniversityVerified email at auburn.edu
- Guanxiong LiuUniversity of California RiversideVerified email at ee.ucr.edu
- Suchismita GhoshIntelVerified email at intel.com
- Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
- Roger K. LakeUniversity of California RiversideVerified email at ece.ucr.edu
- Michael ShurPatricia W. and C. Sheldon Roberts Professor, Rensselaer PolytechnicVerified email at rpi.edu
- Jeanie (Chun Ning) LauOhio State UniversityVerified email at osu.edu
- Wenzhong Bao (包文中)Fudan UniversityVerified email at fudan.edu.cn
- Feng MiaoProfessor of Physics, Nanjing UniversityVerified email at nju.edu.cn
- Zahra BaraniPh.D. in Nanotechnology/Electrical Engineering, University of California RiversideVerified email at ucr.edu
- Alexander KhitunUniversity of California RiversideVerified email at engr.ucr.edu
- Khan M Farhan ShahilNXPVerified email at nxp.com
- Ruben SalgadoUniversity of California, Riverside- Center for Phonon Optimized Engineered Materials (POEM)Verified email at intel.com
- Rameez SamnakayUniversity of California, RiversideVerified email at ucr.edu
- Pradyumna GoliDirector, Global key accountsVerified email at henkel.com
- Amirmahdi MohammadzadehPhD in Electrical Engineering, Nano-Device Laboratory, University of California RiversideVerified email at indiesemi.com
- Ece Aytan ColemanPhD University of California Riverside, IntelVerified email at ucr.edu
- Jackie D. RenteriaPostdoctoral scholar in Electrical Engineering, UC-RiversideVerified email at ucr.edu