| Electrochemical migration of Sn and Sn solder alloys: a review X Zhong, L Chen, B Medgyes, Z Zhang, S Gao, L Jakab RSC advances 7 (45), 28186-28206, 2017 | 96 | 2017 |
| Electrochemical migration behaviour of Cu, Sn, Ag and Sn63/Pb37 B Medgyes, B Illés, G Harsányi Journal of Materials Science: Materials in Electronics 23, 551-556, 2012 | 94 | 2012 |
| Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics B Medgyes, B Horváth, B Illés, T Shinohara, A Tahara, G Harsányi, ... Corrosion Science 92, 43-47, 2015 | 54 | 2015 |
| In situ optical inspection of electrochemical migration during THB tests B Medgyes, B Illés, R Berényi, G Harsányi Journal of Materials Science: Materials in Electronics 22, 694-700, 2011 | 44 | 2011 |
| Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders O Krammer, T Garami, B Horváth, T Hurtony, B Medgyes, L Jakab Journal of Alloys and Compounds 634, 156-162, 2015 | 42 | 2015 |
| The effect of chloride ion concentration on electrochemical migration of copper B Medgyes, X Zhong, G Harsányi Journal of Materials Science: Materials in Electronics 26, 2010-2015, 2015 | 35 | 2015 |
| Electrochemical migration of micro-alloyed low Ag solders in NaCl solution B Medgyes, B Illés, G Harsányi Periodica Polytechnica Electrical Engineering and Computer Science 57 (2), 49-55, 2013 | 35 | 2013 |
| Electrochemical corrosion of SAC alloys: a review A Gharaibeh, I Felhősi, Z Keresztes, G Harsányi, B Illés, B Medgyes Metals 10 (10), 1276, 2020 | 34 | 2020 |
| Electrochemical corrosion and electrochemical migration characteristics of SAC-1Bi-xMn solder alloys in NaCl solution B Medgyes, A Gharaibeh, G Harsányi, B Pécz, I Felhősi Corrosion Science 213, 110965, 2023 | 26 | 2023 |
| Electrochemical migration of Ni and ENIG surface finish during Environmental test contaminated by NaCl B Medgyes Journal of Materials Science: Materials in Electronics 28 (24), 18578-18584, 2017 | 25 | 2017 |
| Effect of current load on corrosion induced tin whisker growth from SnAgCu solder alloys B Illés, T Hurtony, B Medgyes Corrosion Science 99, 313-319, 2015 | 24 | 2015 |
| Numerical simulation of electrochemical migration of Cu based on the Nernst-Plank equation B Illés, B Medgyes, K Dušek, D Bušek, A Skwarek, A Géczy International Journal of Heat and Mass Transfer 184, 122268, 2022 | 23 | 2022 |
| Effect of water condensation on electrochemical migration in case of FR4 and polyimide substrates B Medgyes, B Illés, G Harsányi Journal of Materials Science: Materials in Electronics 24, 2315-2321, 2013 | 21 | 2013 |
| Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys F Li, V Verdingovas, K Dirscherl, G Harsányi, B Medgyes, R Ambat Journal of Materials Science: Materials in Electronics 31, 15308-15321, 2020 | 18 | 2020 |
| Novel PLA/flax based biodegradable printed circuit boards A Géczy, A Csiszár, E Rozs, I Hajdu, B Medgyes, O Krammer, ... 2022 45th International Spring Seminar on Electronics Technology (ISSE), 1-6, 2022 | 17 | 2022 |
| Whisker growth from vacuum evaporated submicron Sn thin films B Illés, A Skwarek, R Bátorfi, J Ratajczak, A Czerwinski, O Krammer, ... Surface and Coatings Technology 311, 216-222, 2017 | 17 | 2017 |
| Evidence for Ag participating the electrochemical migration of 96.5 Sn-3Ag-0.5 Cu alloy X Zhong, W Lu, B Liao, M Bálint, H Junying, Z Yan, Z Dezhi, Z Zhi Corrosion Science, 2019 | 16 | 2019 |
| Corrosion investigations on lead-free micro-alloyed solder alloys used in electronics B Medgyes, P Tamási, F Hajdu, R Murányi, M Lakatos-Varsányi, L Gál, ... 2015 38th International Spring Seminar on Electronics Technology (ISSE), 296-299, 2015 | 16 | 2015 |
| Electrochemical migration of silver on conventional and biodegradable substrates in microelectronics B Medgyes, I Hajdu, R Berényi, L Gál, M Ruszinkó, G Harsányi Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014 | 16 | 2014 |
| On the electrochemical migration mechanism of gold in electronics—less reliable than expected? B Medgyes, A Gharaibeh, D Rigler, G Harsányi Materials 14 (18), 5237, 2021 | 15 | 2021 |
Balazs IllesFull Professor of Budapest University of Technology and EconomicsVerified email at ett.bme.hu
